Light emitting device package

ABSTRACT

A light emitting device package is provided. The light emitting device package may include a main body having a cavity including side surfaces and a bottom, and a first reflective cup and a second reflective cup provided in the bottom of the cavity of the main body and separated from each other. A first light emitting device may be provided in the first reflective cup, and a second light emitting device may be provided in the second reflective cup.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.15/213,548, filed on Jul. 19, 2016, which is a continuation of U.S.patent application Ser. No. 14/865,145 filed on Sep. 25, 2015 (U.S. Pat.No. 9,418,973 issued on Aug. 16, 2016), which is a continuation of U.S.patent application Ser. No. 14/227,104 filed on Mar. 27, 2014 (U.S. Pat.No. 9,165,912 issued Oct. 20, 2015), which is a continuation of U.S.patent application Ser. No. 13/604,706 filed on Sep. 6, 2012 (U.S. Pat.No. 8,791,486 issued Jul. 29, 2014), which is a continuation of U.S.patent application Ser. No. 13/113,327 filed on May 23, 2011 (U.S. Pat.No. 8,269,246 Issued on Sep. 18, 2012), which claims the benefit ofKorean Patent Application No. 10-2010-0051840, filed in Korea on Jun. 1,2010, which are hereby incorporated in their entirety by reference as iffully set forth herein.

BACKGROUND OF THE DISCLOSURE

Field of the Disclosure

This relates to a light emitting device package.

Discussion of the Related Art

A light emitting device, for example, a light emitting diode, mayinclude a semiconductor device which converts electrical energy intolight. Such a light emitting diode may generate light using such asemiconductor device, thus consuming relatively little power comparedto, for example, an incandescent lamp or a fluorescent lamp. The lightemitting diode may generate light using a potential gap of thesemiconductor device, thus providing relatively long lifespan and fastresponse time, and being environmentally friendly.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments will be described in detail with reference to thefollowing drawings in which like reference numerals refer to likeelements wherein:

FIG. 1 is a perspective view of a light emitting device package inaccordance with an embodiment as broadly described herein;

FIG. 2 is a bottom view of the light emitting device package shown inFIG. 1;

FIG. 3 is a first side view of the light emitting device package shownin FIG. 1;

FIG. 4 is a second side view of the light emitting device package shownin FIG. 1;

FIG. 5 is a third side view of the light emitting device package shownin FIG. 1;

FIG. 6 is a fourth side view of the light emitting device package shownin FIG. 1;

FIG. 7 is a plan view of the light emitting device package shown in FIG.1;

FIG. 8 is a cross-sectional view taken along the line A-A′ of the lightemitting device package shown in FIG. 7;

FIG. 9 is a cross-sectional view taken along the line B-B′ of the lightemitting device package shown in FIG. 7;

FIG. 10 illustrates a series connection of light emitting devices of alight emitting device package in accordance with an embodiment asbroadly described herein;

FIG. 11 illustrates a parallel connection of light emitting devices of alight emitting device package in accordance with another embodiment asbroadly described herein;

FIG. 12 illustrates a series connection of light emitting devices of alight emitting device package in accordance with another embodiment asbroadly described herein;

FIG. 13a illustrates a depth of a first reflective cup in accordancewith an embodiment as broadly described herein;

FIG. 13b illustrates a depth of a first reflective cup in accordancewith another embodiment as broadly described herein;

FIG. 13c illustrates a depth of a first reflective cup in accordancewith another embodiment as broadly described herein;

FIG. 14 illustrates a first light emitting device and a second lightemitting device in accordance with an embodiment as broadly describedherein;

FIG. 15 illustrates a first connection between first, second, third, andfourth electrodes in accordance with an embodiment as broadly describedherein;

FIG. 16 illustrates a second connection between first, second, third,and fourth electrodes in accordance with an embodiment as broadlydescribed herein;

FIG. 17 illustrates a third connection between first, second, third, andfourth electrodes in accordance with an embodiment as broadly describedherein;

FIG. 18 is an exploded perspective view of a lighting apparatusincluding a light emitting device package in accordance with anembodiment as broadly described herein; and

FIG. 19 is an exploded perspective view of a display apparatus includinga light emitting device package In accordance with an embodiment asbroadly described herein.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings which form a part hereof, and which show by way ofillustration specific embodiments as broadly described herein. In thedrawings, the thicknesses or sizes of respective layers may beexaggerated, omitted, or schematically illustrated for convenience andclarity of description. Further, the sizes of respective elements do notnecessarily denote the actual sizes thereof. Moreover, the same orsimilar elements are denoted by the same reference numerals wheneverpossible even though they may be depicted in different drawings.

As shown in FIG. 1, a light emitting device package 100 in accordancewith an embodiment as broadly described herein may include a main body110, a first reflective cup 122, a second reflective cup 124, aconnection pad 126, light emitting devices 132 and 134, a zener diode150, and wires 152, 154, 156, 158 and 159.

The main body 110 may be made of a material such as, for example, one ofa resin, such as polyphthalamide (PPA), silicon (Si), a metal,photo-sensitive glass (PSG), sapphire (Al2O3), and a printed circuitboard (PCB). In certain embodiments, the main body 110 is made of aresin, such as polyphthalamide (PPA). The main body 110 may be made of aconductor. If the main body 110 is made of a conductive material, aninsulating film may be formed on the surface of the main body 110 so asto prevent an electrical short of the main body 110 with the firstreflective cup 122, the second reflective cup 124 and the connection pad126.

An upper surface 106 of the main body 110, as seen from the top, mayhave various shapes, such as, for example, a triangle, a rectangle, apolygon, a circle, or other shape as appropriate, according to purposesand designs of a particular light emitting device package. For example,the light emitting device package 100, as shown in FIG. 1, may be usedin an edge-type backlight unit (BLU). If, for example, the lightemitting device package 100 is applied to a portable flashlight or ahome lighting apparatus, the main body 110 may be modified so as to havea size and a shape that may be easily installed within the portableflashlight or the home lighting apparatus.

The main body 110 may include a cavity 105 (hereinafter, referred to asa “main body cavity”). The upper portion of the cavity 105 may be open,and may include side surfaces 102 and a bottom 103. The main body cavity105 may have a cup shape or a concave container shape, and the sidesurfaces 102 of the main body cavity 105 may be perpendicular or tiltedwith respect to the bottom 103. Other arrangements may also beappropriate.

The shape of the main body cavity 105, as seen from the top, may be acircle, an oval, a polygon (for example, a rectangle), or other shape asappropriate. In certain embodiments, the corners of the main body cavity105 may be curved. In the embodiment shown in FIG. 1, the shape of themain body cavity 105, as seen from the top, is essentially an octagon,and the side surfaces 102 of the main body cavity 105 include eightplanes. Four of the eight planes may be referred to as first planes thatform the side surfaces 102 of the main body cavity 105 facing therespective corners of the main body 110, and the remaining four planesmay be referred to as second planes that form elongated side surfaces102 of the main body cavity 105 extending between the first planes. Anarea of the first planes is less than an area of the second planes. Theshape of the opposite planes among the first planes and the secondplanes can be the same. The area of the opposite planes among the firstplanes and the second planes can be equal. In another embodiment, theside surfaces 102 of the main body cavity 105 can include less thaneight planes, and some of the planes can be a curved surface, which canbe opposite each other.

The first reflective cup 122 and the second reflective cup 124 may bepositioned within the main body 110 under the bottom 103 of the mainbody cavity 105 such that the first and second reflective cups 122 and124 are separated from each other by a portion of the bottom 103 of themain body cavity 105. The first reflective cup 122 may be depressed fromthe bottom 103 of the main body cavity 105 with the upper portion of thefirst reflective cup 122 being open.

For example, a first cavity 162 may be formed in the bottom 103 of themain body cavity 105, with an upper portion of the first cavity 162being open. The first cavity 162 may include side surfaces and a bottom,and the first reflective cup 122 may be positioned within the firstcavity 162.

The second reflective cup 124 may be separated from the first cavity 162and also depressed from the bottom 103 of the main body cavity 105, withan upper portion of the second reflective cup 124 being open. Forexample, a second cavity 164 may be formed in the bottom 103 of the mainbody cavity 105, with the upper portion of the second cavity 164 beingopen. The second cavity 164 may include side surfaces and a bottom, andthe second reflective cup 124 may be positioned within the second cavity164. The second cavity 164 may be separated from the first cavity 162 bya portion of the bottom 103 of the main body cavity 105 located betweenthe first reflective cup 122 and the second reflective cup 124, whichseparates and isolates the first reflective cup 122 and the secondreflective cup 124 from each other.

The first cavity 162 and the second cavity 164, as seen from the top,may have a cup shape or a concave container shape, and the side surfacesthereof may be perpendicular or tilted with respect to the bottomsthereof. Other arrangements may also be appropriate.

At least a portion of each of the first reflective cup 122 and thesecond reflective cup 124 may pass through the main body 110 and beexposed to the outside of the main body 110. Since at least a portion ofeach of the first reflective cup 122 and the second reflective cup 124is exposed to the outside of the main body 110, efficiency with whichheat generated by the first light emitting device 132 and the secondemitting chip 134 is emitted to the outside of the main body 110 may beimproved.

For example, one end 142 of the first reflective cup 122 may passthrough a first side surface of the main body 110 and be exposed to theoutside. Similarly, one end 144 of the second reflective cup 124 maypass through a second side surface of the main body 110 and be exposedto the outside. The first side surface and the second side surface ofthe main body 110 may be opposite each other, or otherwise positioned asappropriate.

The first reflective cup 122 and the second reflective cup 124 may bemade of a metal material, such as, for example, silver, gold, copper, orother material, or may be made of a metal plated therewith. The firstreflective cup 122 and the second reflective cup 124 may be made of thesame material as the main body 110, and be integrated with the main body110. Alternatively, the first reflective cup 122 and the secondreflective cup 124 may be made of a different material from the mainbody 110, and be formed separately from the main body 110. In certainembodiments, the first reflective cup 122 and the second reflective cup124 may be symmetrical with regard to the connection pad 126 in terms ofshape and size. The connection pad 126 may be formed within the mainbody 110 under the bottom 103 of the main body cavity 105 such that theconnection pad 126 is separated from the first reflective cup 122 andthe second reflective cup 124. The connection pad 126 may be made of aconductive material.

As shown in FIG. 1, the connection pad 126 may be positioned between thefirst reflective cup 122 and the second reflective cup 124. For example,the connection pad 126 may be positioned at the inside of the bottom 103of the main body cavity 105 adjacent to a third side surface of the mainbody cavity 105 between the first reflective cup 122 and the secondreflective cup 124. Other arrangements may also be appropriate.

At least a portion of the connection pad 126 may pass through the mainbody 110 and be exposed to the outside of the main body 110. Forexample, one end 146 of the connection pad 126 may pass through thethird side surface of the main body cavity 105 and be exposed to theoutside. In this exemplary arrangement, the third side surface of themain body 110 may be perpendicular with respect to the first and secondside surfaces of the main body 110 through which the ends 142 and 144 ofthe first and second reflective cups 122 and 124 pass.

The zener diode 150 may be provided on one of the first reflective cup122 or the second reflective cup 124 so as to improve breakdown voltageof the light emitting device package 100. As shown in FIG. 1, the zenerdiode 150 may be mounted on an upper surface 124-1 of the secondreflective cup 124. Other arrangements may also be appropriate.

FIG. 2 is a bottom view of the light emitting device package shown inFIG. 1, and FIGS. 3-6 are various side views of the light emittingdevice package shown in FIG. 1. With reference to FIGS. 2 to 6, a lowersurface 202 of the first reflective cup 122 is exposed at a lowersurface 107 of the main body 110, through an opening formed therein, andthe end 142 of the first reflective cup 122 protrudes from a first sidesurface 210 of the main body 110 and is exposed to the outside of themain body 110. A lower surface 204 of the second reflective cup 124 isalso exposed at the lower surface 107 of the main body 110, throughanother opening formed therein, and the end 144 of the second reflectivecup 124 protrudes from a second side surface 220 of the main body 110and is exposed to the outside of the main body 110. The end 146 of theconnection part 126 protrudes from a third side surface 230 of the mainbody 110 and is exposed to the outside of the main body 110. The exposedends 142 and 144 and the lower surfaces 202 and 204 of the first andsecond reflective cups 122 and 124 may allow heat generated by the firstlight emitting device 132 and the second emitting chip 134 to betransferred to the outside of the main body 110 and dissipated and thelight emitting device package to be cooled more efficiently.

The exposed ends 142 and 144 of the first and second reflective cups 122and 124 and the exposed end 146 of the connection part 126 may havevarious shapes, such as, for example, a rectangle, a square, a U shape,or other shape as appropriate. A thickness of each of the firstreflective cup 122, second reflective cup 124 and the connection pad 126may be, for example, approximately 200 um˜300 um, and a thickness of theexposed ends 142, 144, 146 may be 0.2 mm˜0.3 mm.

The first light emitting device 132 may be provided within the firstcavity 162 of the first reflective cup 122 and the second light emittingdevice 134 may be provided within the second cavity 164 of the secondreflective cup 124. That is, the first light emitting device 132 may bepositioned on the bottom of the first cavity 162 of the first reflectivecup 122 and the second light emitting device 134 may be positioned onthe bottom of the second cavity 164 of the second reflective cup 124.The first light emitting device 132 may be separated from the sidesurfaces of the first cavity 162 and the second light emitting device134 may be separated from the side surfaces of the second cavity 164. Alength of the first light emitting device 132 and a length of the secondlight emitting device 134 may be, for example, approximately 400 um˜1200um respectively. A width of the first light emitting device 132 and awidth of the second light emitting device 134 may be, for example,approximately 400 um˜1200 um respectively. A thickness of the firstlight emitting device 132 and a thickness of the second light emittingdevice 134 may be, for example, approximately 100 um˜200 umrespectively. For example, a chip size of the first light emittingdevice 132 and a chip size of the second light emitting device may be800 um×400 um. A thickness of the first light emitting device 132 and athickness of the second light emitting device may be 100 um×150 um.

The wires 152, 154, 156 and 158 may connect the first light emittingdevice 132 and the second light emitting device 134 via the connectionpad 126. In the embodiment shown in FIG. 1. The first wire 152 connectsthe first light emitting device 132 and the first reflective cup 122,the second wire 154 connects the first light emitting device 132 and theconnection pad 126, the third wire 156 connects the connection pad 126and the second light emitting device 134, and the fourth wire 158connects the second light emitting device 134 and the second reflectivecup 124. The second wire 154 may be bonded between the connection pad126 and the first light emitting device 132 and the third wire 156 maybe bonded between the connection pad 126 and the second light emittingdevice 134, thereby electrically connecting the first light emittingdevice 132 and the second light emitting device 134.

As shown in FIG. 1, the zener diode 150 may be mounted on the uppersurface 124-1 of the second reflective cup 124 and may be electricallyconnected to the first reflective cup 122 by the fifth wire 159. Forexample, one end of the fifth wire 159 may be bonded to the zener diode150 and the other end of the fifth wire 159 may be bonded to an uppersurface 122-1 of the first reflective cup 122. In alternativeembodiments, the zener diode 150 may be mounted on the upper surface122-1 of the first reflective cup 124, and one end of the fifth wire 159may be bonded to the zener diode 150 and the other end of the fifth wire159 may be bonded to the upper surface 124-1 of the second reflectivecup 124.

The connection pad 126 may be separated from the first reflective cup122 and the second reflective cup 124, thus being independent of thefirst light emitting device 132 and the second light emitting device134. This may allow the connection pad 126 to stably electricallyconnect the first light emitting device 132 and the second lightemitting device 134 in series, thereby improving electrical reliability.

As the first light emitting device 132 and the second light emittingdevice 134 emit light, they may also generate heat in the course ofoperation. The first reflective cup 122 may prevent heat generated bythe first light emitting device 132 from being radiated or transferredto the main body 110, and the second reflective cup 124 may prevent heatgenerated by the second light emitting device 134 from being radiated ortransferred to the main body 110. That is, the first reflective cup 122and the second reflective cup 124 may thermally separate the first lightemitting device 132 and the second light emitting device 134. Further,the first reflective cup 122 and the second reflective cup 124 mayprevent light emitted from the first light emitting device 132, andlight emitted from the second light emitting device 134, frominterfering with each other. Moreover, since the first reflective cup122 and the second reflective cup 124 are positioned at an inner bottomportion of the main body 110, thermal separation between the firstreflective cup 122 and the second reflective cup 124 may be improved andprevention of light interference between the first light emitting device132 and the second light emitting device 134 may be improved.

Consequently, in this embodiment, the first light emitting device 132 ispositioned within the first cavity 162 of the first reflective cup 122and the second light emitting device 134 is positioned within the secondcavity 164 of the second reflective cup 124, thereby being thermally andoptically separated from each other.

A resin injection hole 240 through which a resin may be injected intothe main body 110 may be formed on the lower surface 107 of the mainbody 110. The resin injection hole 240 may be located at a positionbetween the first reflective cup 122 and the second reflective cup 124.

FIG. 7 is a plan view of the light emitting device package shown inFIG. 1. In FIG. 7, simply for clarity convenience of description, thewires 152, 154, 156, 158 and 159 of FIG. 1 are omitted. As shown in FIG.7, the first reflective cup 122 and the second reflective cup 124 may beseparated by a designated distance D1, and the bottom of the main body110, which may be made of polyphthalamide (PPA), may have a portionthereof located therebetween.

In order to separate the heat sources (heat generated by operation ofthe first and second chips 132 and 134) and to effectively prevent lightinterference between the light emitting devices 132 and 134, theseparation distance D1 between the first reflective cup 122 and thesecond reflective cup 124 may be, for example, 100 μm or more. Otherseparation distances may also be appropriate, based on relative sizes ofthe related components.

Further, in order to effectively prevent light interference between thelight emitting devices 132 and 134 and to increase reflectionefficiency, the first light emitting device 132 may be positioned on thebottom of the first reflective cup 124 and separated from the sidesurfaces of the first reflective cup 122 by designated distances, andthe second light emitting device 134 may be positioned on the bottom ofthe second reflective cup 124 and separated from the side surfaces ofthe second reflective cup 124 by designated distances. Separationdistances from the first light emitting device 132 to opposite sidesurfaces of the first reflective cup 122 may be equal or unequal.Separation distances from the second light emitting device 134 toopposite side surfaces of the second reflective cup 124 may be equal orunequal.

For example, a pitch between the first light emitting device 132 mountedon the first reflective cup 122 and the second light emitting device 134mounted on the second reflective cup 124 may be 2 mm˜3 mm.

For example, the first light emitting device 132 may be mounted at thecenter of the bottom of the first reflective cup 122 and the secondlight emitting device 134 may be mounted at the center of the bottom ofthe second reflective cup 124.

In more detail, a separation distance D2 from a short side surface ofthe first reflective cup 122 to the first light emitting device 132 maybe, for example, 200 μm, and a separation distance D3 from a long sidesurface of the first reflective cup 122 to the first light emittingdevice 132 may be, for example, 500 μm. Other separation distances mayalso be appropriate, based on chip size relative to reflective cup size.

The connection pad 126 may be separated from both the first reflectivecup 122 and the second reflective cup 124 by a designated distance D4,and the bottom of the main body 110, which may be, made ofpolyphthalamide (PPA), may have a portion thereof located therebetween.

For example, the separation distance D4 between the first reflective cup122 and the connection pad 126 may be equal to the separation distanceD1 between the first reflective cup 122 and the second reflective cup124. Other separation distances may also be appropriate based onrelative sizes of the related components.

FIG. 8 is a cross-sectional view taken along the line A-A′ of the lightemitting device package shown in FIG. 7. In FIG. 8, simply for clarity,the wires 152, 154, 156, 158 and 159 are omitted.

As shown in FIG. 8, a tilt angle θ1 of the side surfaces of the firstreflective cup 122 may be different from a tilt angle of the sidesurfaces of the main body cavity 105. For example, the tilt angle θ1 ofthe side surfaces of the first reflective cup 122 with respect to thebottom of the first reflective cup 122 may be 90˜160°. Otherorientations may also be appropriate. A tilt angle θ2 of the sidesurfaces 102 of the main body cavity 105 with respect to the bottom 103of the main body cavity 105 may be, for example, 140˜170°.

The upper end of the side surface of the main body cavity 105 mayinclude a bent edge. That is, the side surface of the upper end of themain body cavity 105 may be bent. In more detail, the main body cavity105 may have an edge part 804 which is located between an upper surface802 of the main body 110 and the bottom 103. The edge part 804 may havea height difference K1 with the upper surface 802 of the main body 110,and may be parallel with the upper surface 802 of the main body 110. Forexample, the edge part 804 may be formed at the upper ends of the sidesurfaces 102 of the main body cavity 105.

The height difference K1 between the upper surface 802 of the main bodycavity 105 and the edge part 804 may be, for example. 50˜80 μm, and alength K2 of the edge part 804 may be 50˜130 μm. Other heights/lengthsmay also be appropriate, based on the dimensions of the relatedcomponents. Furthermore, the upper ends of the side surfaces 102 of themain body cavity 105 may have more than two edge parts, each having aheight difference so as to form a series of steps. Formation of the edgepart 804 having the height difference K1 with the upper surface 802 atthe upper ends of the side surfaces 102 of the main body cavity 105 maylengthen a gas infiltration route, thereby preventing external gas frominfiltrating the inside of the light emitting device package 100 andthus improving gas tightness of the light emitting device package 100.

In order to prevent light interference between the light emittingdevices 132 and 134 and to improve light reflection efficiency, a depthH of the first reflective cup 122 and the second reflective cup 124 maybe determined by taking into consideration a height of the lightemitting devices 132 and 134.

For example, as shown in FIG. 13a , the upper surface 122-1 of the firstreflective cup 122 may be parallel with the upper surface of the firstlight emitting device 132 mounted on the bottom 122-2 of the firstreflective cup 122. A depth H1 of the first reflective cup 122 may equalto a height a1 of the first light emitting device 132 (H1=a1). The depthH1 may be a distance between the upper surface 122-1 and the bottom122-2 of the first reflective cup 122. A depth of the second reflectivecup 124 relative to the height of the light emitting chip 134 in thisembodiment may be determined in a similar manner. In certainembodiments, the depth of the first reflective cup 122 may be equal tothe depth of the second reflective cup 124. Other heights of thereflective cups 122 and 124 and corresponding heights of the lightemitting devices 132 and 134 and combinations thereof may also beappropriate.

In the embodiment shown in FIG. 13b , the upper surface 122-1 of thefirst reflective cup 122 is higher than the upper surface of the firstlight emitting device 132 mounted on the bottom 122-2 of the firstreflective cup 122. That is, a depth H2 of the first reflective cup 122is greater than a height a1 of the first light emitting device 132(H2>a1). In certain embodiments, the depth H2 of the first reflectivecup 122 may be greater than the height a1 of the first light emittingdevice 132 and less than twice the height a1 of the first light emittingdevice 132 (a1<H2<2a1). A depth of the second reflective cup 124relative to the light emitting chip 134 in this embodiment may bedetermined in a similar manner.

In the embodiment shown in FIG. 13c , the upper surface 122-1 of thefirst reflective cup 122 is lower than the upper surface of the firstlight emitting device 132 mounted on the bottom 122-2 of the firstreflective cup 122. A depth H3 of the first reflective cup 122 is lessthan a height a1 of the first light emitting device 132 (H3<a1). Incertain embodiments, the depth H3 of the first reflective cup 122 may beless than the height a1 of the first light emitting device 132 andgreater than half the height a1 of the first light emitting device 132(a1/2<H3<a1). A height of the second reflective cup 124 relative to thelight emitting chip 134 in this embodiment may be determined in asimilar manner.

FIG. 9 is a cross-sectional view taken along the line B-B′ of the lightemitting device package shown in FIG. 7. In FIG. 9, the wires 152, 154,156, 158 and 159 are omitted, simply for clarity. As shown in FIG. 9,the upper surface of the connection pad 126 may be substantiallyparallel with the upper surfaces of the first reflective cup 122 and thesecond reflective cup 124, and the end 146 of the connection pad 126 mayform a portion of the bottom of the main body 110 as it passes throughthe third side surface 230 of the main body 110 and is exposed to theoutside of the main body 110.

In the light emitting device package 100 in accordance with thisembodiment, as shown in FIG. 8, the inside of the main body cavity 105may be filled with an encapsulation material 820 so as to seal andprotect the first light emitting device 132 and the second lightemitting device 134.

The encapsulation material 820 may fill the inside of the firstreflective cup 122 in which the first light emitting device 132 ismounted and the inside of the second reflective cup 124 in which thesecond light emitting device 134 is mounted, as well as the inside ofthe main body cavity 105 so as to also isolate the first light emittingdevice 132 and the second light emitting device 134 from the outside.The encapsulation material 820 may be, for example, a silicon, a resin,or other such material. Formation of the encapsulation material 820 maybe achieved by filling the inside of the main body cavity 105 with asilicon or a resin material and then curing the material as appropriate.The encapsulation material 820 may be other materials filled in thecavity 105 in an appropriate manner.

The encapsulation material 820 may include phosphors to changecharacteristics of light emitted from the first light emitting device132 and the second light emitting device 134, and light emitted from thefirst and second light emitting devices 132 and 134 may be excited bythe phosphors to thus implement different colors. For example, if thelight emitting devices 132 and 134 are blue light emitting diodes andthe encapsulation material 820 includes yellow phosphors, blue light isexcited by the yellow phosphors, thereby generating white light. If thelight emitting devices 132 and 134 emit ultraviolet (UV) light, theencapsulation material 820 may include red (R), green (G) and blue (B)phosphors so as to generate white light. Further, a lens may also beprovided on the encapsulation material 820 so as to adjust adistribution of light emitted by the light emitting device package 100.

FIG. 10 illustrates a series connection of light emitting devices of alight emitting device package in accordance with an embodiment asbroadly described herein. As shown in FIG. 10, one end of a first wire1052 may be bonded to the upper surface 122-1 of the first reflectivecup 122 and the other end of the first wire 1052 may be bonded to thefirst light emitting device 132. Further, one end of a second wire 1054may be bonded to the first light emitting device 132 and the other endof the second wire 1054 may be bonded to the connection pad 126. One endof a third wire 1056 may be bonded to the connection pad 126 and theother end of the third wire 1056 may be bonded to the second lightemitting device 134. Further, one end of a fourth wire 1058 may bebonded to the second light emitting device 134 and the other end of thefourth wire 1058 may be bonded to the upper surface 124-1 of the secondreflective cup 124.

The light emitting devices 132 and 134 shown in FIG. 10 may beelectrically connected in series by the first to fourth wires 1052,1054, 1056 and 1058. Since the series connection between the lightemitting devices 132 and 134 shown in FIG. 10 is achieved via theconnection pad 126 independent of the light emitting devices 132 and134, the first light emitting device 132 and the second light emittingdevice 134 may be stably electrically connected in series, therebyimproving electrical reliability of the light emitting device package.

FIG. 11 illustrates a parallel connection of light emitting devices of alight emitting device package in accordance with another embodiment asbroadly described herein. As shown in FIG. 11, one end of a first wire1152 may be bonded to the upper surface 122-1 of the first reflectivecup 122 and the other end of the first wire 1152 may be bonded to thefirst light emitting device 132. One end of a second wire 1154 may bebonded to the first light emitting device 132 and the other end of thesecond wire 1154 may be bonded to the upper surface 124-1 of the secondreflective cup 124. One end of a third wire 1156 may be bonded to theupper surface 122-1 of the first reflective cup 122 and the other end ofthe third wire 1156 may be bonded to the second light emitting device134. Finally, one end of a fourth wire 1158 may be bonded to the secondlight emitting device 134 and the other end of the fourth wire 1158 maybe bonded to the upper surface 124-1 of the second reflective cup 124.Therefore, the light emitting devices 132 and 134 shown in FIG. 11 maybe electrically connected in parallel by the first to fourth wires 1152,1154, 1156 and 1158.

FIG. 12 illustrates a series connection of light emitting devices of alight emitting device package in accordance with another embodiment asbroadly described herein. As shown in FIG. 12, one end of a first wire1252 may be bonded to the upper surface 122-1 of the first reflectivecup 122 and the other end of the first wire 1252 may be bonded to thefirst light emitting device 132. Further, one end of a second wire 1054may be bonded to the first light emitting device 132 and the other endof the second wire 1054 may be bonded directly to the second lightemitting device 134. One end of a third wire 1156 may be bonded to thesecond light emitting device 134 and the other end of the third wire1156 may be bonded to the upper surface 124-1 of the second reflectivecup 124.

The light emitting devices 132 and 134 shown in FIG. 12 may beelectrically connected in series by the first to third wires 1252, 1254and 1256. Differing from FIG. 10, the first light emitting device 132and the second light emitting device 134 are not connected via theconnection pad 126 but are directly connected by the second wire 1254.

The above-described wires respectively bonded to the first reflectivecup 122, the second reflective cup 124, the first light emitting device132, the second light emitting device 134 and the zener diode 150 may belocated under the upper surface 106 of the main body cavity 105.

The above-described embodiments do not describe one cup-type lightemitting device packages, but rather, describe the light emitting devicepackage 100 in which the light emitting devices 132 and 134 arerespectively mounted in two separate reflective cups 122 and 124 in themain body 110. Through such a structure, the light emitting devices 132and 134, which generate heat during operation, may be separated fromeach other, and heat generated by the light emitting devices 132 and 134may be blocked by the reflective cups 122 and 124, thereby preventingdiscoloration of the main body 110 of the light emitting device package100 due to heat and extending lifespan of the light emitting devicepackage 100. Further, the two separate reflective cups 122 and 124 mayprevent light interference between the light emitting devices 132 and134.

FIG. 14 illustrates a structure of a first light emitting device and asecond light emitting device in accordance with an embodiment as broadlydescribed herein. As shown in FIG. 14, the first light emitting device132 may include a substrate 20, a light emitting structure 30, aconductive layer 40, a first electrode 12, and a second electrode 14.The second light emitting device 134 may include a substrate 20, a lightemitting structure 30, a conductive layer 40, a third electrode 16, anda fourth electrode 18. The second light emitting device 134 may includethe same components as those of the first light emitting device 132.

The substrate 20 supports the light emitting structure 30 and may be oneof a sapphire substrate, a silicon Si substrate, zinc oxide ZnOsubstrate, or a nitride semiconductor substrate or a template substratehaving at least one of GaN, InGaN, AlInGaN, SiC, GaP, InP, Ga₂O₃, andGaAs stacked thereon.

The light emitting structure 30 may include a first conductive typesemiconductor layer 32, an active layer 33, and a second conductive typesemiconductor layer 34. For example, the light emitting structure 30 maybe a structure in which the first conductive type semiconductor layer32, the active layer 33, and the second conductive type semiconductorlayer 34 are stacked on the substrate 20 in succession.

The first conductive type semiconductor layer 32 may be arranged on thesubstrate 20 and may include, for example, an n type semiconductor layerselected from a semiconductor material having a composition ofIn_(x)Al_(y)Ga_(1-x-y)N (0≤x≤1, 0≤y≤1, 0≤x+y≤1), for example, GaN, AlN,AlGaN, InGaN, InN, InAlGaN, AlInN, and may be doped with an n typedopant, such as Si, Ge, Sn, Se, Te.

The active layer 33 may be arranged on the first semiconductor layer 32and may include, for example, a semiconductor material having acomposition of In_(x)Al_(y)Ga_(1-x-y)N (0≤x≤1, 0≤y≤1, 0≤x+y≤1), and mayinclude at least one of a quantum wire structure, a quantum dotstructure, a single quantum well structure, or a multi quantum wellstructure MQW.

The second conductive type semiconductor layer 34 may be arranged on theactive layer 33 and may be, for example, a p type semiconductor layerselected from a semiconductor material having a composition ofIn_(x)Al_(y)Ga_(1-x-y)N (0≤x≤1, 0≤y≤1, 0≤x+y≤1), for an example, GaN,AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, and may be doped with a p typedopant, such as Mg, Zn, Ca, Sr, Ba.

The light emitting structure 30 may be a structure in which the secondconductive type semiconductor layer 34, the active layer 33 and aportion of the first conductive type semiconductor layer 32 are mesaetched to expose a region of the first conductive type semiconductorlayer 32.

The conductive layer 40 may be arranged on the second conductive typesemiconductor layer 34. Since the conductive layer 40 not only reducestotal reflection, but also has good light transmissivity, the conductivelayer 40 increases extraction efficiency of the light emitted from theactive layer 33 to the second conductive type semiconductor layer 34.The conductive layer 40 may be formed of a transparent oxide groupmaterial having high transmissivity on a wavelength of a light. Forexample, the transparent oxide group material may be ITO (Indium TinOxide), TO (Tin Oxide), IZO (Indium Zinc Oxide), or ZnO (Zinc Oxide).

The first electrode 12 or the third electrode 16 may be arranged on theexposed region of the first conductive type semiconductor layer 32. Thesecond electrode 14 or the fourth electrode 18 may be arranged on theconductive layer 40. The first electrode 12 and the second electrode 14may be different types of electrodes. The third electrode 16 and thefourth electrode 14 may be different types of electrodes. The firstelectrode 12 and the third electrode 18 may be the same type ofelectrode. The second electrode 14 and the fourth electrode 18 may bethe same type of electrode. For example, the first electrode 12 and thethird electrode 16 may be n-type electrodes, and the second electrode 14and the fourth electrode 18 may be p-type electrodes. The first andfourth electrodes 12,14,16,18 may be a single layer or a multi-layermaterial or an alloy including at least one of Ti, Al, an Al alloy, In,Ta, Pd, Co, Ni, Si, Ge, Ag, an Ag alloy, Au, Hf, Pt, Ru, or Au.

FIG. 15 illustrates a first connection between first, second, third, andfourth electrodes in accordance with an embodiment as broadly describedherein. One of the first electrode 12 or the second electrode 14 may beelectrically connected to the first reflective cup 122, and one of thethird electrode 16 or the fourth electrode 18 may be electricallyconnected to the second reflective cup 124. The connection pad 126electrically connects the other of the first electrode 12 or the secondelectrode 14 with the other of the third electrode 16 and the fourthelectrode 18.

For example, the first electrode 12 of the first light emitting device132 may be electrically connected to the first reflective cup 122 by thefirst wire 1052, and the fourth electrode 18 of the second lightemitting device 134 may be electrically connected to the secondreflective cup 124 by the fourth wire 1058. The connection pad 126 mayelectrically connect the second electrode 14 of the first light emittingdevice 132 with the third electrode 16 of the second light emittingdevice 134 by the second and third wires 1054 and 1056. The secondelectrode 14 of the first light emitting device may be electricallyconnected to the connection pad 126 by the second wire 1054, and thethird electrode 16 of the second light emitting device 134 may beelectrically connected to the connection pad 126 by the third wire 1056.

FIG. 16 illustrates a second connection between first, second, third,and fourth electrodes in accordance with an embodiment as broadlydescribed herein. As shown in FIG. 16, one of the first electrode 12 orthe second electrode 14 may be electrically connected to the firstreflective cup 122, and one of the third electrode 16 or the fourthelectrode 18 may be electrically connected to the second reflective cup124. The other of the first electrode 12 or the second electrode 14 maybe electrically connected to the second reflective cup 124. The other ofthe third electrode 16 or the fourth electrode 18 may be electricallyconnected to the first reflective cup 122.

For example, the first electrode 12 of the first light emitting device132 may be electrically connected to the first reflective cup 122 by thefirst wire 1152, and the fourth electrode 18 of the second lightemitting device 134 may be electrically connected to the secondreflective cup 124 by the fourth wire 1158. The second electrode 14 ofthe first light emitting device may be electrically connected to thesecond reflective cup 124 by the second wire 1154, and the thirdelectrode 16 of the second electrode 134 may be electrically connectedto the first electrode 122 by the third wire 1056.

FIG. 17 illustrates a third connection between first, second, third, andfourth electrodes in accordance with an embodiment as broadly describedherein. As shown in FIG. 17, one of the first electrode 12 or the secondelectrode 14 may be electrically connected to the first reflective cup122, and one of the third electrode 16 or the fourth electrode 18 may beelectrically connected to the second reflective cup 124. The other ofthe first electrode 12 or the second electrode 14 may be electricallyconnected to the other of the third electrode 16 or the fourth electrode18.

For example, the first electrode 12 of the first light emitting device132 may be electrically connected to the first reflective cup 122 by thefirst wire 1252, and the fourth electrode 18 of the second lightemitting device 134 may be electrically connected to the secondreflective cup 124 by the fourth wire 1258. The second electrode 14 ofthe first light emitting device may be electrically connected to thethird electrode 16 of the second light emitting device 134 by the thirdwire 1254.

FIG. 18 is an exploded perspective view of a lighting apparatusincluding a light emitting device package as embodied and broadlydescribed herein. The lighting apparatus may include a light source 750to emit light, a housing 700 in which the light source 750 is installed,a heat dissipation device 740 to dissipate heat of the light source 750,and a holder 760 to connect the light source 750 and the heatdissipation device 740 to the housing 700.

The housing 700 may include a socket connector 710 for connection to anelectric socket, and a body 730 connected with the socket connector 710.An air flow hole 720 may be formed through the body 730.

Alternatively, a plurality of air flow holes 720 may be formed throughthe body 730. That is, one air flow hole 720 may be formed through thebody 730, or a plurality of air flow holes arranged in a radial shapemay be formed through the body 730. Other arrangements of the plural airflow holes 730 may also be appropriate.

The light source 750 may include a substrate 754 and a plurality oflight emitting device packages 752 provided on the substrate 754. Thesubstrate 754 may have a shape capable of being inserted into an openingof the housing 700 and may be made of a material having a relativelyhigh thermal conductivity so as to transfer heat to the heat dissipationdevice 740.

The holder 760 may be provided under the light source 750. The holder760 may include a frame and additional air flow holes. An optical membermay also be provided under the light source 750 so as to diffuse,scatter or converge light emitted from the light emitting devicepackages 752 of the light source 750. The lighting apparatus inaccordance with this embodiment may employ a light emitting devicepackage in accordance with an embodiment as broadly described herein,thereby extending lifespan of the light emitting device package mountedon the lighting apparatus and preventing light interference.

FIG. 19 is an exploded perspective view of a display apparatus includinga light emitting device package as embodied and broadly describedherein.

The display apparatus 800 may include a light source module, areflective plate 820 provided over a bottom cover 810, a light guideplate 840 positioned in front of the reflective plate 820 to guide lightemitted from the light source module to the front portion of the displayapparatus 800, optical sheets including, for example, prism sheets 850and 860 positioned in front of the light guide plate 840, a panel 870positioned in front of the prism sheets 850 and 860, and a color filter880 positioned in front of the panel 870. The bottom cover 810, thereflective plate 820, the light source module, the light guide plate 840and the optical sheet may form a backlight unit.

The light source module may include a substrate 830 and light emittingdevice packages 835 provided on the substrate 830. A printed circuitboard (PCB) may be used as the substrate 830 and the light emittingdevice package 100 shown in FIG. 1 may be used as the light emittingdevice package 835. Other combinations may also be appropriate.

The bottom cover 810 may receive components in the display apparatus800. The reflective plate 820 may be provided as a separate element, asshown in FIG. 15, or may be provided by coating the rear surface of thelight guide plate 840 or the front surface of the bottom cover 810 witha material having high reflectivity. The reflective plate 820 may bemade of a material having relatively high reflectivity and beingusable/able to be manufactured in an ultra thin state, such as, forexample, polyethylene terephthalate (PET), or other such material.

The light guide plate 840 may scatter light emitted from the lightsource module so as to uniformly distribute the light throughoutvarious/all regions of the display apparatus 800. Therefore, the lightguide plate 840 may be made of a material having relatively highrefractivity and transmittance, such as, for example,polymethylmethacrylate (PMMA), polycarbonate (PC), polyethylene (PE), orother such material.

A first prism sheet 850 may be formed by coating one surface of a basefilm with a polymer exhibiting light transmittance and elasticity, andthe polymer may include a prism layer in which plural three-dimensionalstructures are repeated in a designated pattern. The pattern may be, forexample, a stripe type in which ridges and valleys are repeated, asshown in FIG. 15, or other pattern as appropriate.

A second prism sheet 860 may be configured such that an arrangementdirection of ridges and valleys formed on one surface of a base film ofthe second prism sheet 860 is vertical with respect to an arrangementdirection of the ridges and valleys formed on one surface of the basefilm of the first prism sheet 850. Such a configuration may uniformlydistribute light transmitted from the light module and the reflectivesheet 820 toward the entire surface of the panel 870.

A protective sheet may be provided over each of the prism sheets 850 and860. The protective sheet may include protective layers, includinglight-diffusing particles and a binder, on both surfaces of a base film.Further, the prism layer may be made of a polymer such as, for example,polyurethane, styrene-butadiene copolymer, polyacrylate,polymethacrylate, polymethyl methacrylate, polyethyleneterephthalateelastomer, polysoprene, polysilicon and the like.

A diffusion sheet may be provided between the light guide plate 840 andthe first prism sheet 850. The diffusion sheet may be made of apolyester or polycarbonate-based material and may maximally increase alight projection angle through refraction and scattering of lightincident from the backlight unit. Further, the diffusion sheet mayinclude a support layer including a light diffusing agent, and firstlayer formed on a light emitting surface (in the direction of the firstprism sheet) and a second layer formed on a light incident surface (Inthe direction of the reflective sheet). The first and second layers mayexclude a light diffusing agent.

In this embodiment, the optical sheets may include a combination of thediffusion sheet, the first prism sheet 850 and the second prism sheet860. However, the optical sheets may include other combinations, suchas, for example, a microlens array, a combination of a diffusion sheetand a microlens array, or a combination of a prism sheet and a microlensarray.

A liquid crystal display panel may be used as the panel 870. However,other kinds of display devices requiring light sources may also beemployed. The display panel 870 may be configured such that a liquidcrystal layer is located between glass substrates and polarizing platesare mounted over both glass substrates so as to utilize polarizingproperties of light. Such a liquid crystal layer may have propertiesbetween a liquid and a solid. That is, in the liquid crystal layer,liquid crystals which are organic molecules having fluidity like aliquid are regularly aligned, and the liquid crystal layer displays animage using changes in molecule alignment due to an external electricfield.

Such a liquid crystal display panel used in the display apparatus may bean active matrix type, and may use transistors as switches to adjustvoltage applied to each pixel. Further, a color filter 880 may beprovided on the front surface of the panel 870, and may transmit only R,G and B light projected from the panel 870 per pixel, thereby displayingan image.

The display apparatus in accordance with this embodiment may employ alight emitting device package as embodied and broadly described herein,thereby preventing light interference between the light emitting devices132 and 134.

A light emitting device package as embodied and broadly described hereinmay prevent discoloration of a main body so as to extend lifespan of thelight emitting device package, and may prevent light interference.

A light emitting device package as embodied and broadly described hereinmay include a main body having a cavity including side surfaces and abottom, a first reflective cup and a second reflective cup disposed inthe bottom of the cavity of the main body and separated from each other,a first light emitting device disposed in the first reflective cup, anda second light emitting device disposed in the second reflective cup.The first reflective cup and the second reflective cup may be depressedfrom the bottom of the cavity of the main body. The first reflective cupand the second reflective cup may be made of one selected from the groupincluding of silver, gold and copper.

The first reflective cup and the second reflective cup may prevent heatgenerated by the first light emitting device and the second lightemitting device from being radiated to the main body.

At least a portion of each of the first reflective cup and the secondreflective cup may pass through the main body and be exposed to theoutside of the main body. The first reflective cup and the secondreflective cup may be symmetrical in terms of shape and size. A tiltangle of the side surfaces of each of the first reflective cup and thesecond reflective cup with respect to the bottom thereof may be 90˜160°.

The light emitting device package may also include an edge part locatedbetween an upper surface of the main body and the bottom of the cavityof the main body, having a height difference with the upper surface ofthe main body and being parallel with the upper surface of the mainbody. The upper surface of the first reflective cup may be parallel withthe upper surface of the first light emitting device and the uppersurface of the second reflective cup may be parallel with the uppersurface of the second light emitting device.

In another embodiment as broadly described herein, a light emittingdevice package may include a main body having a cavity including sidesurfaces and a bottom, a first reflective cup and a second reflectivecup disposed in the bottom of the cavity of the main body and separatedfrom each other, a first light emitting device disposed within the firstreflective cup, a second light emitting device disposed within thesecond reflective cup, and a connection part formed in the bottom of thecavity of the main body and separated from the first reflective cup andthe second reflective cup, wherein the first light emitting device andthe second light emitting device are electrically connected by theconnection part. The first reflective cup and the second reflective cupmay be depressed from the bottom of the cavity of the main body.

The light emitting device package may also include a first wireconnecting the first reflective cup and the first light emitting device,a second wire connecting the first light emitting device and theconnection part, a third wire connecting the connection part and thesecond light emitting device, and a fourth wire connecting the secondlight emitting device and the second reflective cup, wherein the firstlight emitting device and the second light emitting device are connectedin series by the first wire, the second wire, the third wire, and thefourth wire.

The light emitting device package may also include a first wireconnecting the first reflective cup and the first light emitting device,a second wire connecting the first light emitting device and the secondreflective cup, a third wire connecting the first reflective cup and thesecond light emitting device, and a fourth wire connecting the secondlight emitting device and the second reflective cup, wherein the firstlight emitting device and the second light emitting device are connectedin parallel by the first wire, the second wire, the third wire, and thefourth wire.

The light emitting device package may also include a first wireconnecting the first reflective cup and the first light emitting device,a second wire connecting the first light emitting device and the secondlight emitting device, and a third wire connecting the second lightemitting device and the second reflective cup, wherein the first lightemitting device and the second light emitting device are connected inseries by the first wire, the second wire, and the third wire.

At least a portion of each of the first reflective cup, the secondreflective cup and the connection part may pass through the main bodyand be exposed to the outside of the main body.

A light emitting device package as embodied and broadly described hereinmay include a main body having a cavity formed therein, the cavityincluding side surfaces and a bottom, and a first reflective cup and asecond reflective cup provided in the bottom of the cavity and separatedfrom each other by a portion of the bottom of the cavity, and a firstlight emitting device provided in the first reflective cup, and a secondlight emitting device provided in the second reflective cup.

The first reflective cup and the second reflective cup may form recessesin the bottom of the cavity. A portion of each of the first reflectivecup and the second reflective cup may pass through the main body and beexposed outside of the main body. The first reflective cup and thesecond reflective cup may be substantially symmetrical in shape andsize. A tilt angle of respective side surfaces of each of the firstreflective cup and the second reflective cup with respect to therespective bottom surface thereof may be between 90° and 160°.

The light emitting device package may also include a stepped edge formedbetween an upper surface of the main body and an upper end of the cavityformed therein, the stepped edge having a prescribed height differencewith the upper surface of the main body and being parallel to the uppersurface of the main body. An upper surface of the first reflective cupmay be parallel to an upper surface of the first light emitting deviceand an upper surface of the second reflective cup may be parallel to anupper surface of the second light emitting device. A height of the firstreflective cup may be greater than a height of the first light emittingdevice and a height of the second reflective cup may be greater than aheight of the second light emitting device. A depth of the firstreflective cup may be greater than a height of the first light emittingdevice and may be less than twice the height of the first light emittingdevice and a depth of the second reflective cup may be greater than aheight of the second light emitting device and may be less than twicethe height of the second light emitting device. A height of the firstreflective cup may be less than a height of the first light emittingdevice and a height of the second reflective cup may be less than aheight of the second light emitting device. A depth of the firstreflective cup may be less than a height of the first light emittingdevice and may be greater than half the height of the first lightemitting device and a depth of the second reflective cup may be lessthan a height of the second light emitting device and may be greaterthan half the height of the second light emitting device.

The light emitting device package may also include an encapsulationmaterial filling an inside of the cavity of the main body, an inside ofthe first reflective cup in which the first light emitting device isprovided and an inside of the second reflective cup in which the secondlight emitting device is provided so as to isolate the first lightemitting device and the second light emitting device from the outside.

A light emitting device package as embodied and broadly described hereinmay include a main body having a cavity formed therein, and a firstreflective cup and a second reflective cup provided in a bottom of thecavity, and a first light emitting device provided in the firstreflective cup, and a second light emitting device provided in thesecond reflective cup, and a connection pad provided in the bottom ofthe cavity and separated from the first reflective cup and the secondreflective cup.

The first and second reflective cups may be separated from each other bya portion of the bottom of the cavity, and wherein the first lightemitting device and the second light emitting device may be electricallyconnected via the connection pad.

The light emitting device package may also include a first wireconnecting the first reflective cup and the first light emitting device,and a second wire connecting the first light emitting device and theconnection pad, and a third wire connecting the connection pad and thesecond light emitting device, and a fourth wire connecting the secondlight emitting device and the second reflective cup, wherein the firstlight emitting device and the second light emitting device are connectedin series by the first wire, the second wire, the third wire, and thefourth wire.

The light emitting device package may also include a first wireconnecting the first reflective cup and the first light emitting device,and a second wire connecting the first light emitting device and thesecond reflective cup, and a third wire connecting the first reflectivecup and the second light emitting device, and a fourth wire connectingthe second light emitting device and the second reflective cup, whereinthe first light emitting device and the second light emitting device areconnected in parallel by the first wire, the second wire, the thirdwire, and the fourth wire.

The light emitting device package may also include a first wireconnecting the first reflective cup and the first light emitting device,and a second wire connecting the first light emitting device and thesecond light emitting device, and a third wire connecting the secondlight emitting device and the second reflective cup, wherein the firstlight emitting device and the second light emitting device are connectedin series by the first wire, the second wire, and the third wire.

A light emitting device package as embodied and broadly described hereinmay include first and second reflective cups positioned adjacent to eachother, wherein a contour of the first and second reflective cups formfirst and second cavities, respectively, and first and second lightemitting devices respectively provided in the first and second cavitiesformed in the first and second reflective cups, and a side wallsurrounding outer peripheral portions of the first and second reflectivecups, and a dividing wall provided between the first and secondreflective cups, wherein a height of the dividing wall is less than aheight of the side wall.

The side walls may extend upward from top surfaces of the first andsecond reflective cups to define a third cavity. The first and secondreflective cups may form recesses in a bottom of the third cavity. Afirst portion of the first reflective cup and a first portion of thesecond reflective cup may be exposed to an outside of the light emittingdevice package through respective openings in the bottom of the thirdcavity. A second portion of the first reflective cup and a secondportion of the second reflective cup may extend through respectiveportions of the side walls to an outside of the light emitting devicepackage.

The light emitting device package may also include a connection padprovided on the bottom of the third cavity, separated from the firstreflective cup and the second reflective cup, wherein the first lightemitting device and the second light emitting device are electricallyconnected via the connection pad. The light emitting device package mayalso include a plurality of wires each having a first end connected toone of the first or second light emitting device and a second endconnected to one of the first or second reflective cup, respectively, orthe connection pad.

A top surface of the first light emitting device may be positioned belowa top edge of the first reflective cup and a top surface of the secondlight emitting device may be positioned below a top edge of the secondreflective cup. A top surface of the first light emitting device mayextend beyond a top edge of the first reflective cup and a top surfaceof the second light emitting device may extend beyond a top edge of thesecond reflective cup. A top surface of the first light emitting devicemay be substantially parallel to a top surface of the first reflectivecup and a top surface of the second light emitting device may besubstantially parallel to a top surface of the second reflective cup.

A depth of the first reflective cup may be greater than a height of thefirst light emitting device and may be less than twice the height of thefirst light emitting device, and a depth of the second reflective cupmay be greater than a height of the second light emitting device and maybe less than twice the height of the second light emitting device.

A depth of the first reflective cup may be less than a height of thefirst light emitting device and may be greater than half the height ofthe first light emitting device, and a depth of the second reflectivecup may be less than a height of the second light emitting device andmay be greater than half the height of the second light emitting device.

A light emitting device package as embodied and broadly described hereinmay include a main body, and a first reflective cup and a secondreflective cup provided in the main body, and separated from each otherby a portion of the main body, and a first light emitting deviceprovided in the first reflective cup, and a second light emitting deviceprovided in the second reflective cup, wherein the first reflective cupand the second reflective cup are made of a different material from themain body.

The light emitting device package may also include a connection padprovided in the main body, and separated from the first reflective cupand the second reflective cup, wherein the connection pad is made of adifferent material from the main body. The first light emitting deviceand the second light emitting device may be electrically connected viathe connection pad. The main body may be made of a material such aspolyphthalamide (PPA), or silicon (Si), photo-sensitive glass (PSG), orsapphire (Al2O3).

A light emitting device package as embodied and broadly described hereinmay include a main body, and a first reflective cup and a secondreflective cup provided in the main body, and a first light emittingdevice provided in the first reflective cup, wherein the first lightemitting device includes a first electrode and a second electrode, and asecond light emitting device provided in the second reflective cup,wherein the second light emitting device includes a third electrode anda fourth electrode, wherein the first electrode is electricallyconnected to the first reflective cup and the fourth electrode isconnected to the second reflective cup, and the first electrode and thefourth electrode have different polarity each other.

The second electrode may be electrically connected to the secondreflective cup and the third electrode may be electrically connected tothe first reflective cup. The second electrode may be electricallyconnected to the third electrode.

The light emitting device package may also include a connection padprovided in the main body and separated from the first reflective cupand the second reflective cup, wherein the connection pad electricallyconnects the second electrode with the third electrode. The firstelectrode and the third electrode may have the same polarity.

A light emitting device package as embodied and broadly described hereinmay include a bottom body, and a first reflective cup provided in thebottom body, and a second reflective cup provided in the bottom andseparated from the first reflective cup by a portion of the bottom body,and a first light emitting device provided in the first reflective cup,and a second light emitting device provided in the second reflectivecup, and side surfaces on the bottom body surrounding the firstreflective cup and the second reflective cup. The light emitting devicepackage may also include a connection pad in the bottom body andseparated from the first reflective cup and the second reflective cup byanother portion of the bottom body.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effect such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

What is claimed is:
 1. A light emitting device package, comprising: amain body including a bottom portion, first and second walls on thebottom portion extending in a first direction, and third and fourthwalls on the bottom portion extending in a second directionperpendicular to the first direction; a first reflective metal providedin the bottom portion of the main body; a second reflective metalprovided in the bottom portion of main body and separated from the firstreflective metal; a first emitting device disposed on a top surface ofthe first reflective metal; a second light emitting device disposed on atop surface of the second reflective metal; a wire connected between thefirst light emitting device and the second light emitting device;wherein the first reflective metal is exposed at an outer surface of thefirst wall of the main body, and the second reflective metal is exposedat an outer surface of the second wall of the main body, wherein a lowersurface of the first reflective metal and a lower surface of the secondreflective metal are exposed at the lower surface of the main body,wherein the exposed lower surface of the first reflective metal and theexposed lower surface of the second reflective metal flush with thelower surface of the main body, wherein the bottom portion includes afirst portion and a second portion disposed between the first reflectivemetal and the second reflective metal, wherein the first portion islocated on the second portion, wherein a length in the second directionof die second portion, is different from a length in the seconddirection of the first portion.
 2. The light emitting device package ofclaim 1, wherein the length in the second direction of the secondportion is greater than the length in the second direction of the firstportion.
 3. The light emitting device package of claim 1, wherein thelength in the second direction of the second portion decreases withincreasing a distance from a lower surface of the second portion.
 4. Thelight emitting device package of claim 3, wherein an upper surface ofthe first portion flushes with an upper surface of the first reflectivemetal and an upper surface of the second reflective metal.
 5. The lightemitting device package of claim 4, wherein the upper surface of thefirst portion includes a first region having a constant length in thesecond direction, and wherein the wire is located over the first region.6. The light emitting device package of claim 1, wherein the first lightemitting device and the second light emitting device are connected inseries by the wire.
 7. The light emitting device package of claim 1,wherein the first light emitting device comprises a first substrate, afirst light emitting structure on the first substrate including afirst-first conductive type semiconductor, an first active layer, and afirst-second conductive type semiconductor, a first electrode on thefirst-first conductive type semiconductor, and a second electrode on thefirst-first conductive type semiconductor, wherein the second lightemitting device comprises a second substrate, a second light emittingstructure on the second substrate including a second-first conductivetype semiconductor, an second active layer, and a second-secondconductive type semiconductor, a third electrode on the second-firstconductive type semiconductor, and a fourth electrode on thesecond-first conductive type semiconductor.
 8. The light emitting devicepackage of claim 7, wherein the wire connects the second electrode ofthe first light emitting device and the third electrode of the secondlight emitting device; and wherein the first electrode and the thirdelectrode are n type electrode, and the second electrode and the fourthelectrode are p type electrode.
 9. A light emitting device package,comprising: a main body including bottom portion, first and second wallson the bottom portion extending in a first direction, and third andfourth walls on the bottom portion extending in a second directionperpendicular to the first direction; a first reflective metal providedin the bottom portion of the main body; a second reflective metalprovided in the bottom portion of main body and separated from the firstreflective metal; a first light emitting device disposed on a topsurface of the first reflective metal; and a second light emittingdevice disposed on a top surface of the second reflective metal; whereinthe first reflective metal is exposed at an outer surface of the firstwall of the main body, and the second reflective metal is exposed at anouter surface of the second wall of the main body, and the first wall ofthe main body is opposite to the second wall of the main body, whereineach of the exposed the first reflective metal and the exposed thesecond reflective metal has two protrusions extending in the seconddirection and spaced away from each other, wherein a lower surface ofthe first reflective metal and a lower surface of the second reflectivemetal are exposed at a lower surface of the main body, wherein theexposed lower surface of the first reflective metal and the exposedlower surface of the second reflective metal flush with the lowersurface of the main body, wherein a portion of the main body is disposedbetween a first portion of the first reflective metal and a secondportion of the second reflective metal, and wherein an upper surface ofthe first portion of the first reflective metal includes a firststraight portion extending in the first direction and a first slopedportion sloped with respect to the first straight portion.
 10. The lightemitting device package of claim 9, further comprising: a zener diodedisposed on the upper surface of the second reflective metal; and afirst wire connecting the zener diode with the upper surface of thefirst reflective metal.
 11. The light emitting device package of claim9, wherein an upper surface of the second portion of the secondreflective metal includes a second straight portion extending in thefirst direction and a second sloped portion sloped with respect to thesecond straight portion.
 12. The light emitting device package of claim9, wherein the first light emitting device comprises a first substrate,a first light emitting structure on the first substrate including afirst-first conductive type semiconductor, an first active layer, and afirst-second conductive type semiconductor, a first electrode on thefirst-first conductive true semiconductor, and a second electrode on thefirst-second conductive type semiconductor, wherein the second lightemitting device comprises a second substrate, a second light emittingstructure on, the second, substrate including a second-first conductivetype semiconductor, an second active layer, and a second-secondconductive type semiconductor, a third electrode on the second-firstconductive type semiconductor, and a fourth electrode on thesecond-second conductive type semiconductor.
 13. The light emittingdevice package of claim 12, wherein the first electrode of the firstemitting device is electrically connected to the first reflective metalby a second wire, the fourth electrode of the second emitting device iselectrically connected to the second reflective metal by a third wire,the second electrode of the first emitting device is electricallyconnected to the second reflective metal by a fourth wire, and the thirdelectrode of the second electrode is electrically connected to the firstreflective metal by a fifth wire.
 14. The light emitting device packageof claim 9, wherein a first tilt angle of an inner surface of the thirdwall of the main body between the third wall of the main body and thefirst light emitting device or between the third wall of the main bodyand the second light emitting device is different to a second tilt angleof the inner surface of the third wall at a center line of the thirdwall of the main body in the second direction.
 15. The light emittingdevice package of claim 9, a first distance passing by the first lightemitting device or the second light emitting device between the thirdwall and the fourth wall in the first direction is different to a seconddistance between the third wall and the fourth wall in the firstdirection at a center line of the main body in the second direction. 16.The light emitting device package of claim 9, wherein the main body hasa resin injection hole formed on the lower surface of the main body.